AIR PRODUCTS INTRODUCES EZSTRIP™ 520 SERIES, A NEW LINE OF ETCH RESIDUE REMOVERS FOR ADVANCED SEMICONDUCTORS
LEHIGH VALLEY, Pa. (July 5, 2004) — Air Products (NYSE:APD) and its ACT® Electronic Chemicals business has launched the EZStrip™ 520 Series, a new line of fluoride-containing etch and ash residue removers to complement its expanding EZStrip product line. The series offers a new solvent platform that provides a wide process latitude and is compatible with both Low-K and Copper (Cu) applications.
The EZStrip series of etch residue removers was engineered and introduced to the market in 2003. Since then, Air Products has grown the portfolio to include three separate series: EZStrip™ 1, EZStrip™ 500 and EZStrip™ 520. The product line offers solutions for the complete and economical removal of all forms of processing residues, contaminants, and polymers.
"These latest advances in our EZStrip product line are designed to meet customer requirements that are evolving along with the marketplace," said Eric Tribolet, Business Manager, ACT® Electronic Chemicals. "We're positioning ourselves to meet that demand by developing innovative solutions for the advanced semiconductor industry."
The latest additions to the new series are EZStrip 520 and EZStrip 522, both of which are designed to perform in the advanced semiconductor market and, specifically, memory and logic applications. EZStrip 520 is an etch residue remover that is compatible with Cu and porous Low-K materials. EZStrip 520 has shown good material compatibility with thin-film chalcogenide materials used in Phase RAM (PRAM), a next generation of non-volatile memories (NVM).
EZStrip 522 is a more aggressive version of EZStrip 520 and is compatible with dense Low-K materials. Designed specifically for single wafer tools, EZStrip 522 fosters good selectivity for the removal of an anti-reflective coating (ARC) and photoresist while protecting the inter-layer dielectric (ILD).
Air Products' ACT® Electronic Chemicals business is a worldwide leader in etch residue removal and photoresist stripping.